The TWL1103TPBSG4Q1 is a specialized audio IC from Texas Instruments, packaged in a 32-pin TQFP lead-frame SMT package. It has a maximum package length, width, and height of 5.05mm, 5.05mm, and 1.05mm, respectively. The seated plane height is 1.2mm, and the pin pitch is 0.5mm. The package material is plastic, and it is designed for surface mount applications. The IC is compliant with the Jedec MS-026AAA standard.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | TQFP |
| Package Description | Thin Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 5.05(Max) |
| Package Width (mm) | 5.05(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026AAA |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Texas Instruments TWL1103TPBSG4Q1 to view detailed technical specifications.
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