PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TXS0206-29YFPR technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
20
PCB
20
Package Length (mm)
2.4
Package Width (mm)
2
Package Height (mm)
0.33(Max)
Seated Plane Height (mm)
0.5(Max)
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Logic Function
Voltage Level Translator
Output Type
Open Drain
Maximum Low Level Output Current
8mA
Maximum High Level Output Current
-8mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TXS0206-29YFPR Datasheet
Download the complete datasheet for Texas Instruments TXS0206-29YFPR to view detailed technical specifications.
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