
The UCD7231RTJR is a surface-mount power management IC from Texas Instruments, packaged in a 20-pin WQFN EP non-lead-frame SMT package. It features a very thin quad flat no lead package with an exposed pad. The package measures 4mm in length and 4mm in width, with a seated plane height of 0.8mm maximum. The IC is suitable for surface mount applications and is made of plastic material. Operating temperature range is not specified in the provided data.
Texas Instruments UCD7231RTJR technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | WQFN EP |
| Package Description | Very Very Thin Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 4 |
| Package Width (mm) | 4 |
| Package Height (mm) | 0.73 |
| Seated Plane Height (mm) | 0.8(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Texas Instruments UCD7231RTJR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.