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Technical Specifications
Texas Instruments V62/10605-01XE technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 5(Max) |
| Package Width (mm) | 3.98(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AA |
| Number of Channels per Chip | 1 |
| Maximum Input Offset Voltage | 0.1@±15VmV |
| Maximum Input Bias Current | 0.008@±15VuA |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Minimum Dual Supply Voltage | ±2.25V |
| Maximum Dual Supply Voltage | ±18V |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments V62/10605-01XE Datasheet
Download the complete datasheet for Texas Instruments V62/10605-01XE to view detailed technical specifications.
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