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Technical Specifications
Thin Film HE2LABA110D T5-C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 10.16 |
| Package Width (mm) | 6.35 |
| Seated Plane Height (mm) | 1.1(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Passive Delay Line |
| Maximum Delay Time Range | <5ns |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 07WP9 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Thin Film HE2LABA110D T5-C Datasheet
Download the complete datasheet for Thin Film HE2LABA110D T5-C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.