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Technical Specifications
Thin Film HE2LABA160DT5-C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
8
PCB
8
Package Length (mm)
10.16
Package Width (mm)
6.35
Seated Plane Height (mm)
1.1(Max)
Package Material
Plastic
Mounting
Surface Mount
Category
Passive Delay Line
Maximum Delay Time Range
<5ns
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
07WP9
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Thin Film HE2LABA160DT5-C Datasheet
Download the complete datasheet for Thin Film HE2LABA160DT5-C to view detailed technical specifications.
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