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Technical Specifications
Toshiba 1SS315(T3SAMS) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | USC |
| Package/Case | USC |
| Lead Shape | Gull-wing |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 1.7 |
| Package Width (mm) | 1.25 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 0.9 |
| Package Weight (g) | 0.0045 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | SOD-323 |
| Type | Schottky Diode |
| Configuration | Single |
| Maximum Reverse Voltage | 5V |
| Maximum Forward Voltage | 0.25(Typ)@0.002AV |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba 1SS315(T3SAMS) Datasheet
Download the complete datasheet for Toshiba 1SS315(T3SAMS) to view detailed technical specifications.
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