Small signal Schottky diode, dual common cathode configuration, designed for surface mount applications. Features a 15V peak reverse repetitive voltage and a maximum continuous forward current of 0.2A. Packaged in a 3-pin ESM (SC-89) lead-frame SMT with dimensions of 1.6mm length, 0.85mm width, and 0.7mm height, a 0.5mm pin pitch, and a maximum power dissipation of 100mW. Operates within a temperature range of -40°C to 100°C.
PackageESM
MountingSurface Mount
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Technical Specifications
Toshiba 1SS385F(T3SONY) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | ESM |
| Package/Case | ESM |
| Lead Shape | Flat |
| Pin Count | 3 |
| PCB | 3 |
| Package Length (mm) | 1.6 |
| Package Width (mm) | 0.85 |
| Package Height (mm) | 0.7 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | SC-89 |
| Type | Small Signal Schottky Diode |
| Configuration | Dual Common Cathode |
| Peak Reverse Repetitive Voltage | 15V |
| Maximum Continuous Forward Current | 0.2A |
| Peak Non-Repetitive Surge Current | 1A |
| Peak Forward Voltage | [email protected]V |
| Peak Reverse Current | 20uA |
| Maximum Power Dissipation | 100mW |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Operating Junction Temperature | 125°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | No |
| HTS Code | 8541100070 |
| Schedule B | 8541100070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba 1SS385F(T3SONY) Datasheet
Download the complete datasheet for Toshiba 1SS385F(T3SONY) to view detailed technical specifications.
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