PackageSIP
MountingThrough Hole
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Technical Specifications
Toshiba 1SV147(LB101,PAIO) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
SIP
Package/Case
SIP
Package Description
Single In Line Package
Lead Shape
Through Hole
Pin Count
3
PCB
3
Package Length (mm)
4.2(Max)
Package Width (mm)
2.6(Max)
Package Height (mm)
3.2(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Through Hole
Type
Tuner
Configuration
Dual Common Cathode
Maximum Reverse Voltage
15V
Minimum Tuning Ratio
2.1
Tuning Ratio Test Condition
3V/8V
Minimum Diode Capacitance
28.5@3VpF
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
S0562
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba 1SV147(LB101,PAIO) Datasheet
Download the complete datasheet for Toshiba 1SV147(LB101,PAIO) to view detailed technical specifications.
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