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Technical Specifications
Toshiba 1SV239(T3TDK) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
USC
Package/Case
USC
Lead Shape
Gull-wing
Pin Count
2
PCB
2
Package Length (mm)
1.7
Package Width (mm)
1.25
Package Height (mm)
0.9
Seated Plane Height (mm)
0.9
Package Weight (g)
0.0045
Package Material
Plastic
Mounting
Surface Mount
Jedec
SOD-323
Type
VCO
Configuration
Single
Maximum Reverse Voltage
15V
Minimum Tuning Ratio
2
Tuning Ratio Test Condition
2V/10V
Minimum Diode Capacitance
3.8@2VpF
Applications Frequency Range
UHF
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
S0562
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba 1SV239(T3TDK) Datasheet
Download the complete datasheet for Toshiba 1SV239(T3TDK) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.