PackagePW-Mold
MountingThrough Hole
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Technical Specifications
Toshiba 2SC3233(MATUD) technical specifications.
General
Package/Case
PW-Mold
Pin Count
3
PCB
3
Tab
Tab
Package Length (mm)
6.5
Package Width (mm)
5.5
Package Height (mm)
2.3
Seated Plane Height (mm)
2.4
Package Weight (g)
0.36
Mounting
Through Hole
Type
NPN
Configuration
Single
Number of Elements per Chip
1
Maximum Collector Base Voltage
500V
Maximum Emitter Base Voltage
7V
Maximum Collector-Emitter Voltage
400V
Maximum DC Collector Current
2A
Maximum Power Dissipation
1000mW
Material
Si
Minimum DC Current Gain
8@1A@5V|[email protected]@5V
Category
Bipolar Power
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba 2SC3233(MATUD) Datasheet
Download the complete datasheet for Toshiba 2SC3233(MATUD) to view detailed technical specifications.
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