PackageTO-3PL
MountingThrough Hole
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Technical Specifications
Toshiba 2SC5570(LBSONY) technical specifications.
General
Package/Case
TO-3PL
Pin Count
3
PCB
3
Tab
Tab
Package Length (mm)
20
Package Width (mm)
5
Package Height (mm)
26
Pin Pitch (mm)
5.45
Mounting
Through Hole
Type
NPN
Configuration
Single
Number of Elements per Chip
1
Maximum Collector Base Voltage
1700V
Maximum Emitter Base Voltage
5V
Maximum Collector-Emitter Voltage
800V
Maximum DC Collector Current
28A
Maximum Power Dissipation
220000mW
Material
Si
Minimum DC Current Gain
22@2A@5V|12.5@8A@5V|4.5@22A@5V
Maximum Transition Frequency
2(Typ)MHz
Category
Bipolar Power
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
HTS Code
8541290095
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba 2SC5570(LBSONY) Datasheet
Download the complete datasheet for Toshiba 2SC5570(LBSONY) to view detailed technical specifications.
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