PackageTO-3P(HIS)
MountingThrough Hole
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Technical Specifications
Toshiba 2SD2499(LB303,M) technical specifications.
General
Package/Case
TO-3P(HIS)
Pin Count
3
PCB
3
Tab
Tab
Package Length (mm)
15.5
Package Width (mm)
5.5
Package Height (mm)
16.5
Seated Plane Height (mm)
29
Package Weight (g)
5.5
Mounting
Through Hole
Jedec
SC-65
Type
NPN
Configuration
Single
Maximum Collector-Emitter Voltage
600V
Maximum Continuous DC Collector Current
6mA
Maximum Power Dissipation
50000mW
Typical Input Resistor
40kOhm
Maximum Base Emitter Saturation Voltage
Maximum Collector-Emitter Saturation Voltage
Minimum DC Current Gain
8@1A@5V|5@4A@5V
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
HTS Code
8541290095
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba 2SD2499(LB303,M) Datasheet
Download the complete datasheet for Toshiba 2SD2499(LB303,M) to view detailed technical specifications.
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