N-channel enhancement mode silicon power MOSFET featuring a 600V drain-source voltage and 7.5A continuous drain current. This through-hole component is housed in a TO-220SIS package with a 3-pin configuration and tab. Key specifications include a maximum power dissipation of 45W, a typical input capacitance of 1300pF at 25V, and a maximum drain-source on-resistance of 1000mΩ at 10V. Operating temperature range is -55°C to 150°C.
PackageTO-220SIS
MountingThrough Hole
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Technical Specifications
Toshiba 2SK3667(LBS1MATUDQ technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | TO-220 |
| Package/Case | TO-220SIS |
| Package Description | Transistor Outline Package |
| Lead Shape | Through Hole |
| Pin Count | 3 |
| PCB | 3 |
| Tab | Tab |
| Package Length (mm) | 10 |
| Package Width (mm) | 4.5 |
| Package Height (mm) | 15 |
| Seated Plane Height (mm) | 17 |
| Pin Pitch (mm) | 2.54 |
| Package Weight (g) | 1.7 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Configuration | Single |
| Category | Power MOSFET |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Maximum Drain Source Voltage | 600V |
| Maximum Gate Source Voltage | ±30V |
| Maximum Continuous Drain Current | 7.5A |
| Material | Si |
| Maximum Drain Source Resistance | 1000@10VmOhm |
| Typical Gate Charge @ Vgs | 33@10VnC |
| Typical Gate Charge @ 10V | 33nC |
| Typical Input Capacitance @ Vds | 1300@25VpF |
| Maximum Power Dissipation | 45000mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8541290095 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Toshiba 2SK3667(LBS1MATUDQ Datasheet
Download the complete datasheet for Toshiba 2SK3667(LBS1MATUDQ to view detailed technical specifications.
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