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Technical Specifications
Toshiba DF2B6.8FS(TPL4,D) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package/Case | fSC |
| Lead Shape | Flat |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 0.8 |
| Package Width (mm) | 0.6 |
| Package Height (mm) | 0.48 |
| Seated Plane Height (mm) | 0.48 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Configuration | Single |
| Type | Diode Array |
| Direction Type | Bi-Directional |
| Maximum Working Voltage | 5V |
| Maximum Power Dissipation | 150mW |
| Maximum Clamping Voltage | 8.5(Typ)V |
| Maximum Leakage Current | 0.5uA |
| Capacitance | 15(Typ)pF |
| Number of Elements per Chip | 1 |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8536308000 |
| Schedule B | 8536300000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Toshiba DF2B6.8FS(TPL4,D) Datasheet
Download the complete datasheet for Toshiba DF2B6.8FS(TPL4,D) to view detailed technical specifications.
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