PackagefSC
Capacitance15(Typ)pF
MountingSurface Mount
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Technical Specifications
Toshiba DF2B6.8FS(TPL4,D) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package/Case
fSC
Lead Shape
Flat
Pin Count
2
PCB
2
Package Length (mm)
0.8
Package Width (mm)
0.6
Package Height (mm)
0.48
Seated Plane Height (mm)
0.48
Package Material
Plastic
Mounting
Surface Mount
Configuration
Single
Type
Diode Array
Direction Type
Bi-Directional
Maximum Working Voltage
5V
Maximum Power Dissipation
150mW
Maximum Clamping Voltage
8.5(Typ)V
Maximum Leakage Current
0.5uA
Capacitance
15(Typ)pF
Number of Elements per Chip
1
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
EU RoHS
Yes with Exemption
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Toshiba DF2B6.8FS(TPL4,D) Datasheet
Download the complete datasheet for Toshiba DF2B6.8FS(TPL4,D) to view detailed technical specifications.
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