PackagesESC
Capacitance40(Typ)pF
MountingSurface Mount
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Technical Specifications
Toshiba DF2S5.6S(TPL3) technical specifications.
General
Package/Case
sESC
Lead Shape
Flat
Pin Count
2
PCB
2
Package Length (mm)
1
Package Width (mm)
0.6
Package Height (mm)
0.52
Seated Plane Height (mm)
0.52
Mounting
Surface Mount
Configuration
Single
Type
Zener
Direction Type
Uni-Directional
Maximum Working Voltage
3.5V
Maximum Power Dissipation
150mW
Maximum Leakage Current
1uA
Capacitance
40(Typ)pF
Number of Elements per Chip
1
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba DF2S5.6S(TPL3) Datasheet
Download the complete datasheet for Toshiba DF2S5.6S(TPL3) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.