PackagesESC
MountingSurface Mount
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Technical Specifications
Toshiba DF2S8.2S(TPL3) technical specifications.
General
Package/Case
sESC
Lead Shape
Flat
Pin Count
2
PCB
2
Package Length (mm)
1
Package Width (mm)
0.6
Package Height (mm)
0.52
Seated Plane Height (mm)
0.52
Mounting
Surface Mount
Configuration
Single
Type
Zener
Maximum Power Dissipation
150mW
Maximum Leakage Current
0.5uA
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
EU RoHS
No
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba DF2S8.2S(TPL3) Datasheet
Download the complete datasheet for Toshiba DF2S8.2S(TPL3) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.