PackageESM
MountingSurface Mount
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Technical Specifications
Toshiba DF3A3.3FE(TPL3,F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
ESM
Package/Case
ESM
Lead Shape
Flat
Pin Count
3
PCB
3
Package Length (mm)
1.6
Package Width (mm)
0.85
Package Height (mm)
0.7
Seated Plane Height (mm)
0.7
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
SC-89
Configuration
Dual Common Anode
Type
Zener
Maximum Power Dissipation
100mW
Maximum Leakage Current
20uA
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
S0562
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba DF3A3.3FE(TPL3,F) Datasheet
Download the complete datasheet for Toshiba DF3A3.3FE(TPL3,F) to view detailed technical specifications.
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