PackageESM
MountingSurface Mount
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Technical Specifications
Toshiba DF3A6.8FE(T3SONY) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
ESM
Package/Case
ESM
Lead Shape
Flat
Pin Count
3
PCB
3
Package Length (mm)
1.6
Package Width (mm)
0.85
Package Height (mm)
0.7
Seated Plane Height (mm)
0.7
Package Material
Plastic
Mounting
Surface Mount
Configuration
Dual Common Anode
Type
Zener
Maximum Power Dissipation
100mW
Maximum Leakage Current
0.5uA
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
S0562
EU RoHS
No
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba DF3A6.8FE(T3SONY) Datasheet
Download the complete datasheet for Toshiba DF3A6.8FE(T3SONY) to view detailed technical specifications.
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