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Technical Specifications
Toshiba DF3A8.2LFE(T3SONY) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | ESM |
| Package/Case | ESM |
| Lead Shape | Flat |
| Pin Count | 3 |
| PCB | 3 |
| Package Length (mm) | 1.6 |
| Package Width (mm) | 0.85 |
| Package Height (mm) | 0.7 |
| Seated Plane Height (mm) | 0.7 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | SC-89 |
| Configuration | Dual Common Anode |
| Type | Zener |
| Maximum Power Dissipation | 100mW |
| Maximum Leakage Current | 0.5uA |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | No |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba DF3A8.2LFE(T3SONY) Datasheet
Download the complete datasheet for Toshiba DF3A8.2LFE(T3SONY) to view detailed technical specifications.
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