PackageVESM
Capacitance0.5pF
MountingSurface Mount
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Technical Specifications
Toshiba DF3D6.8MFV technical specifications.
General
Package/Case
VESM
Pin Count
3
PCB
3
Package Length (mm)
1.2
Package Width (mm)
0.8
Seated Plane Height (mm)
0.5
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Configuration
Dual
Type
Diode Array
Direction Type
Uni-Directional
Maximum Working Voltage
5V
Maximum Clamping Voltage
15(Typ)V
Maximum Leakage Current
0.5uA
Capacitance
0.5pF
Number of Elements per Chip
2
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Datasheet
Toshiba DF3D6.8MFV Datasheet
Download the complete datasheet for Toshiba DF3D6.8MFV to view detailed technical specifications.
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