PackageSSM
MountingSurface Mount
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Technical Specifications
Toshiba RN1113F(T3SONY,F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
ESM
Package/Case
SSM
Lead Shape
Flat
Pin Count
3
PCB
3
Package Length (mm)
1.6
Package Width (mm)
0.8
Package Height (mm)
0.7
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
SC-89
Type
NPN
Configuration
Single
Maximum Collector-Emitter Voltage
50V
Maximum Continuous DC Collector Current
100mA
Maximum Power Dissipation
100mW
Typical Input Resistor
47kOhm
Maximum Collector-Emitter Saturation Voltage
[email protected]@5mAV
Minimum DC Current Gain
120@1mA@5V
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8541210075
Schedule B
8541210080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba RN1113F(T3SONY,F) Datasheet
Download the complete datasheet for Toshiba RN1113F(T3SONY,F) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.