PackageTO-3P(HIS)
MountingThrough Hole
Quick Jump:
Technical Specifications
Toshiba S2000N(LBSONY,M) technical specifications.
General
Package/Case
TO-3P(HIS)
Pin Count
3
PCB
3
Tab
Tab
Package Length (mm)
15.5
Package Width (mm)
5.5
Package Height (mm)
16.5
Seated Plane Height (mm)
29
Package Weight (g)
5.5
Mounting
Through Hole
Jedec
SC-65
Type
NPN
Configuration
Single
Number of Elements per Chip
1
Maximum Emitter Base Voltage
5V
Maximum Collector-Emitter Voltage
1500V
Maximum DC Collector Current
8A
Maximum Power Dissipation
50000mW
Material
Si
Minimum DC Current Gain
10@1A@5V|[email protected]@5V
Maximum Transition Frequency
2(Typ)MHz
Category
Bipolar Power
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
HTS Code
8541290095
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba S2000N(LBSONY,M) Datasheet
Download the complete datasheet for Toshiba S2000N(LBSONY,M) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.