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Technical Specifications
Toshiba SSM3K38MFV technical specifications.
General
| Package/Case | VESM |
| Pin Count | 3 |
| PCB | 3 |
| Package Length (mm) | 1.2 |
| Package Width (mm) | 0.8 |
| Pin Pitch (mm) | 0.4 |
| Mounting | Surface Mount |
| Configuration | Single |
| Category | Power MOSFET |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Maximum Drain Source Voltage | 20V |
| Maximum Gate Source Voltage | ±10V |
| Maximum Continuous Drain Current | 0.18A |
| Material | Si |
| Maximum Drain Source Resistance | 1500@4VmOhm |
| Typical Input Capacitance @ Vds | 9.5@3VpF |
| Maximum Power Dissipation | 150mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | S0562 |
| HTS Code | 8541210095 |
| Schedule B | 8541210080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba SSM3K38MFV Datasheet
Download the complete datasheet for Toshiba SSM3K38MFV to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.