24-Pin SSOP Modulator for RF and Wireless applications. Surface mountable lead-frame SMT package with gull-wing leads, measuring 8.3mm max length, 5.6mm width, and 1.2mm height. Features a 0.65mm pin pitch and operates within a -20°C to 75°C temperature range. Supports supply voltages from 4.5V to 35V with a maximum power dissipation of 850mW.
PackageSSOP
MountingSurface Mount
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Technical Specifications
Toshiba TA1297AFNG(M) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 8.3(Max) |
| Package Width (mm) | 5.6 |
| Package Height (mm) | 1.2 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Weight (g) | 0.14 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Device Type | Modulator |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 75°C |
| Programmability | No |
| Min Operating Supply Voltage | 4.5|27V |
| Typical Operating Supply Voltage | 5|33V |
| Max Operating Supply Voltage | 5.5|35V |
| Maximum Power Dissipation | 850mW |
| Maximum Supply Current | 66A |
Compliance
| Cage Code | S0562 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TA1297AFNG(M) Datasheet
Download the complete datasheet for Toshiba TA1297AFNG(M) to view detailed technical specifications.
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