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Technical Specifications
Toshiba TA2009F(ER) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
8.7(Max)
Package Width (mm)
4.6
Package Height (mm)
1.5
Seated Plane Height (mm)
1.9(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Type
Low Pass Filter
Number of Circuits
2
Power Supply Type
Single
Min Operating Temperature
-35°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TA2009F(ER) Datasheet
Download the complete datasheet for Toshiba TA2009F(ER) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.