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Technical Specifications
Toshiba TA31275FNG(NDTP) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
8.3(Max)
Package Width (mm)
5.6
Package Height (mm)
1.2
Seated Plane Height (mm)
1.6(Max)
Package Weight (g)
0.14
Package Material
Plastic
Mounting
Surface Mount
Frequency Band
100 to 450MHz
Min Operating Supply Voltage
2.4V
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Maximum Power Dissipation
780mW
Compliance
Cage Code
S0562
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TA31275FNG(NDTP) Datasheet
Download the complete datasheet for Toshiba TA31275FNG(NDTP) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.