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Technical Specifications
Toshiba TA8083AF(NDT) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | HSOP |
| Package/Case | HSOP |
| Package Description | Heat Sinked Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 22 |
| PCB | 20 |
| Tab | 2Tab |
| Package Length (mm) | 16.5(Max) |
| Package Width (mm) | 8.8 |
| Package Height (mm) | 2.3 |
| Seated Plane Height (mm) | 2.7(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | S0562 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TA8083AF(NDT) Datasheet
Download the complete datasheet for Toshiba TA8083AF(NDT) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.