PackageHSOP
MountingSurface Mount
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Technical Specifications
Toshiba TA8083FG(RICO,ELP) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Lead Shape
Gull-wing
Pin Count
22
PCB
20
Tab
2Tab
Package Length (mm)
16.5(Max)
Package Width (mm)
8.8
Package Height (mm)
2.3
Seated Plane Height (mm)
2.7(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Type
Motor Driver
Min Operating Supply Voltage
8V
Max Operating Supply Voltage
16V
Maximum Operating Current
60mA
Min Operating Temperature
-40°C
Max Operating Temperature
110°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TA8083FG(RICO,ELP) Datasheet
Download the complete datasheet for Toshiba TA8083FG(RICO,ELP) to view detailed technical specifications.
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