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Technical Specifications
Toshiba TB2118F(EL,SONY) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 13.5(Max) |
| Package Width (mm) | 6 |
| Package Height (mm) | 1.8 |
| Seated Plane Height (mm) | 2.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | High Speed PLL For DTS |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TB2118F(EL,SONY) Datasheet
Download the complete datasheet for Toshiba TB2118F(EL,SONY) to view detailed technical specifications.
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