PackageSSOP
MountingSurface Mount
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Technical Specifications
Toshiba TB31202FNG(ELP,HZK technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
5.5(Max)
Package Width (mm)
4.4
Package Height (mm)
1.2
Seated Plane Height (mm)
1.6(Max)
Package Material
Plastic
Mounting
Surface Mount
Type
PLL Frequency Synthesizer
Number of Elements per Chip
1
Maximum Input Frequency
520MHz
Min Operating Supply Voltage
2V
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-30°C
Max Operating Temperature
85°C
Operating Frequency Range
5 to 520MHz
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TB31202FNG(ELP,HZK Datasheet
Download the complete datasheet for Toshiba TB31202FNG(ELP,HZK to view detailed technical specifications.
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