PackageHSOP
MountingSurface Mount
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Technical Specifications
Toshiba TB62201AFG(NANOTEC technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Lead Shape
Gull-wing
Pin Count
38
PCB
36
Tab
2Tab
Package Length (mm)
18.8
Package Width (mm)
7.13
Package Height (mm)
2.3
Package Material
Plastic
Mounting
Surface Mount
Type
Motor Driver
Output Voltage
40(Max)V
Min Operating Supply Voltage
4.5V
Typical Operating Supply Voltage
5V
Max Operating Supply Voltage
5.5V
Maximum Operating Current
80mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TB62201AFG(NANOTEC Datasheet
Download the complete datasheet for Toshiba TB62201AFG(NANOTEC to view detailed technical specifications.
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