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Technical Specifications
Toshiba TB62218AFNG technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
HTSSOP EP
Package Description
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12.5
Package Width (mm)
6.1
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153EDT
Type
Motor Driver
Output Voltage
40(Max)V
Min Operating Supply Voltage
4.75V
Typical Operating Supply Voltage
5V
Max Operating Supply Voltage
5.25V
Min Operating Temperature
-20°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TB62218AFNG Datasheet
Download the complete datasheet for Toshiba TB62218AFNG to view detailed technical specifications.
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