PackageSSOP
MountingSurface Mount
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Technical Specifications
Toshiba TB62747BFNAG(EL,M) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
8.74(Max)
Package Width (mm)
3.99(Max)
Seated Plane Height (mm)
1.73(Max)
Pin Pitch (mm)
0.64
Package Material
Plastic
Mounting
Surface Mount
High Level Output Current
-1000uA
Low Level Output Current
1000uA
Output Voltage
26(Max)V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
5.5V
Maximum Power Dissipation
1560mW
Maximum Supply Current
8000uA
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TB62747BFNAG(EL,M) Datasheet
Download the complete datasheet for Toshiba TB62747BFNAG(EL,M) to view detailed technical specifications.
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