PackageSSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
Toshiba TB62779FNG(O,EL) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
7(Max)
Package Width (mm)
4.4
Package Height (mm)
1.2
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.65
Package Weight (g)
0.1
Package Material
Plastic
Mounting
Surface Mount
Output Voltage
0.4 to 4V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
5.5V
Maximum Power Dissipation
1020mW
Maximum Supply Current
12000uA
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
S0562
EU RoHS
Yes with Exemption
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Toshiba TB62779FNG(O,EL) Datasheet
Download the complete datasheet for Toshiba TB62779FNG(O,EL) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.