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Technical Specifications
Toshiba TC6387XBG(Z) technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
64
PCB
64
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
0.81
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC6387XBG(Z) Datasheet
Download the complete datasheet for Toshiba TC6387XBG(Z) to view detailed technical specifications.
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