The TC6387XBG(Z) is a 64-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 7mm in length and 7mm in width, with a height of 0.81mm and seated plane height of 1.2mm maximum. It features a pin pitch of 0.8mm and is made of plastic. The IC is designed for surface mount applications. Toshiba manufactures this USB Interface IC.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Toshiba TC6387XBG(Z) technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 7 |
| Package Width (mm) | 7 |
| Package Height (mm) | 0.81 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | S0562 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba TC6387XBG(Z) Datasheet
Download the complete datasheet for Toshiba TC6387XBG(Z) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.