CMOS buffer/line driver IC featuring four non-inverting, 3-state elements. This surface-mount component utilizes a 14-pin Small Outline IC (SOL) package with gull-wing leads, measuring 8.65mm in length and 3.9mm in width. Operating within a temperature range of -40°C to 85°C, it is designed for lead-frame SMT mounting.
PackageSOL
MountingSurface Mount
PolarityNon-Inverting
Quick Jump:
Technical Specifications
Toshiba TC74AC125FN(M) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOL |
| Package Description | Small Outline IC (L Lead) |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.65 |
| Package Width (mm) | 3.9 |
| Package Height (mm) | 1.38 |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AB |
| Logic Family | AC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 4 |
| Number of Inputs per Chip | 4 |
| Number of Outputs per Chip | 4 |
| Process Technology | CMOS |
| Polarity | Non-Inverting |
| Output Type | 3-State |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba TC74AC125FN(M) Datasheet
Download the complete datasheet for Toshiba TC74AC125FN(M) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.