4-channel non-inverting 3-state CMOS buffer/line driver. This integrated circuit features four independent buffer elements, each with one input and one output. The device is housed in a 14-pin Small Outline IC (SOL) package with gull-wing leads, designed for surface mounting. Operating within a temperature range of -40°C to 85°C, it utilizes CMOS process technology.
PackageSOL
MountingSurface Mount
PolarityNon-Inverting
Quick Jump:
Technical Specifications
Toshiba TC74AC126FN(ELP,M) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOL
Package Description
Small Outline IC (L Lead)
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Length (mm)
8.65
Package Width (mm)
3.9
Package Height (mm)
1.38
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AB
Logic Family
AC
Logic Function
Buffer/Line Driver
Number of Elements per Chip
4
Number of Inputs per Chip
4
Number of Outputs per Chip
4
Process Technology
CMOS
Polarity
Non-Inverting
Output Type
3-State
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74AC126FN(ELP,M) Datasheet
Download the complete datasheet for Toshiba TC74AC126FN(ELP,M) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.