Positive-edge triggered D-type bus interface flip-flop, featuring a single element with 4 inputs and 4 outputs. This surface-mount integrated circuit utilizes CMOS process technology and belongs to the AC logic family. Housed in a 16-pin Small Outline IC (SOL) package with gull-wing leads, it offers a 1.27mm pin pitch and operates within a temperature range of -40°C to 85°C.
PackageSOL
MountingSurface Mount
PolarityInverting/Non-Inverting
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Technical Specifications
Toshiba TC74AC175FN(ELP,M) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOL
Package Description
Small Outline IC (L Lead)
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
9.9
Package Width (mm)
3.9
Package Height (mm)
1.38
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Logic Family
AC
Logic Function
D-Type Bus Interface
Process Technology
CMOS
Number of Elements per Chip
1
Number of Element Inputs
4
Number of Element Outputs
4
Polarity
Inverting/Non-Inverting
Triggering Type
Positive-Edge
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74AC175FN(ELP,M) Datasheet
Download the complete datasheet for Toshiba TC74AC175FN(ELP,M) to view detailed technical specifications.
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