PackageSOL
MountingSurface Mount
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Technical Specifications
Toshiba TC74AC280FN(ELP,M) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOL
Package Description
Small Outline IC (L Lead)
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Length (mm)
8.65
Package Width (mm)
3.9
Package Height (mm)
1.38
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AB
Logic Family
AC
Logic Function
Parity Generator/Checker
Number of Bits
9
Number of Elements per Chip
1
Process Technology
CMOS
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74AC280FN(ELP,M) Datasheet
Download the complete datasheet for Toshiba TC74AC280FN(ELP,M) to view detailed technical specifications.
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