Dual JK-type flip-flop IC, negative-edge triggered, featuring CMOS process technology and ACT logic family. This surface-mount component is housed in a 16-pin SOP package with gull-wing leads, offering 2 elements per chip, each with 2 inputs and 1 output. The plastic small outline package measures 10.8mm (Max) in length and 5.3mm in width, with a 1.27mm pin pitch, operating within a temperature range of -40°C to 85°C.
PackageSOP
MountingSurface Mount
PolarityInverting/Non-Inverting
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Technical Specifications
Toshiba TC74ACT112F(F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOP
Package Description
Plastic Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
10.8(Max)
Package Width (mm)
5.3
Package Height (mm)
1.5
Seated Plane Height (mm)
1.9(Max)
Pin Pitch (mm)
1.27
Package Weight (g)
0.18
Package Material
Plastic
Mounting
Surface Mount
Logic Family
ACT
Logic Function
JK-Type
Process Technology
CMOS
Number of Elements per Chip
2
Number of Element Inputs
2
Number of Element Outputs
1
Polarity
Inverting/Non-Inverting
Triggering Type
Negative-Edge
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TC74ACT112F(F) Datasheet
Download the complete datasheet for Toshiba TC74ACT112F(F) to view detailed technical specifications.
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