PackageSOL
MountingSurface Mount
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Technical Specifications
Toshiba TC74ACT280F(F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOL
Package Description
Small Outline IC (L Lead)
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Length (mm)
8.65
Package Width (mm)
3.9
Package Height (mm)
1.38
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AB
Logic Family
ACT
Logic Function
Parity Generator/Checker
Number of Bits
9
Number of Elements per Chip
1
Process Technology
CMOS
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TC74ACT280F(F) Datasheet
Download the complete datasheet for Toshiba TC74ACT280F(F) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.