PackagePDIP
MountingThrough Hole
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Technical Specifications
Toshiba TC74ACT280P(F) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
14
PCB
14
Package Length (mm)
19.75(Max)
Package Width (mm)
6.4
Package Height (mm)
3.5
Seated Plane Height (mm)
4.15
Pin Pitch (mm)
2.54
Package Weight (g)
0.96
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-001AA
Logic Family
ACT
Logic Function
Parity Generator/Checker
Number of Bits
9
Number of Elements per Chip
1
Process Technology
CMOS
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TC74ACT280P(F) Datasheet
Download the complete datasheet for Toshiba TC74ACT280P(F) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.