Dual JK-type flip-flop IC, featuring negative-edge triggering and CMOS logic family. This 16-pin SOL (Small Outline IC) package, with gull-wing leads, is designed for surface mounting. It offers 2 elements per chip, each with 2 inputs and 1 output, supporting inverting/non-inverting polarity. Operating across a temperature range of -40°C to 85°C, the lead-frame SMT component has a 1.27mm pin pitch.
PackageSOL
MountingSurface Mount
PolarityInverting/Non-Inverting
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Technical Specifications
Toshiba TC74HC112AFN(ELF,M technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOL
Package Description
Small Outline IC (L Lead)
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
9.9
Package Width (mm)
3.9
Package Height (mm)
1.38
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Logic Family
HC
Logic Function
JK-Type
Process Technology
CMOS
Number of Elements per Chip
2
Number of Element Inputs
2
Number of Element Outputs
1
Polarity
Inverting/Non-Inverting
Triggering Type
Negative-Edge
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TC74HC112AFN(ELF,M Datasheet
Download the complete datasheet for Toshiba TC74HC112AFN(ELF,M to view detailed technical specifications.
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