Dual JK-type flip-flop IC featuring negative-edge triggering and CMOS logic family. This 16-pin Small Outline IC (SOL) with gull-wing leads is designed for surface mounting on PCBs. It operates within a temperature range of -40°C to 85°C and offers 2 elements per chip, each with 2 inputs and 1 output. The lead-frame SMT package measures 9.9mm x 3.9mm x 1.38mm with a 1.27mm pin pitch.
PackageSOL
MountingSurface Mount
PolarityInverting/Non-Inverting
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Technical Specifications
Toshiba TC74HC112AFN(ELPM) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOL |
| Package Description | Small Outline IC (L Lead) |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 9.9 |
| Package Width (mm) | 3.9 |
| Package Height (mm) | 1.38 |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | HC |
| Logic Function | JK-Type |
| Process Technology | CMOS |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 2 |
| Number of Element Outputs | 1 |
| Polarity | Inverting/Non-Inverting |
| Triggering Type | Negative-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba TC74HC112AFN(ELPM) Datasheet
Download the complete datasheet for Toshiba TC74HC112AFN(ELPM) to view detailed technical specifications.
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