The Toshiba TC74HC20AFN(F,M) is a 14-pin SOP NAND gate integrated circuit with a lead-frame SMT package. It features a small outline IC (L lead) with a gull-wing lead shape and a seated plane height of 1.75mm (max). The device operates over a temperature range of -40 to 85°C and is designed for surface mount applications. It is part of the HC logic family and uses CMOS process technology.
PackageSOL
MountingSurface Mount
Quick Jump:
Technical Specifications
Toshiba TC74HC20AFN(F,M) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOL |
| Package Description | Small Outline IC (L Lead) |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.65 |
| Package Width (mm) | 3.9 |
| Package Height (mm) | 1.38 |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AB |
| Logic Family | HC |
| Logic Function | NAND |
| Process Technology | CMOS |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 4-IN |
| Number of Element Outputs | 1 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Toshiba TC74HC20AFN(F,M) Datasheet
Download the complete datasheet for Toshiba TC74HC20AFN(F,M) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.