CMOS buffer/line driver featuring 8 non-inverting, 3-state outputs. This integrated circuit utilizes HC logic family technology and is housed in a 20-pin SOP package with gull-wing leads for surface mounting. The plastic small outline package measures 13.3mm maximum length, 5.3mm width, and 1.5mm height, with a 1.27mm pin pitch. Operating across a temperature range of -40°C to 85°C, this component is designed for lead-frame SMT applications.
PackageSOP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Toshiba TC74HC241AF(J) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOP |
| Package Description | Plastic Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 13.3(Max) |
| Package Width (mm) | 5.3 |
| Package Height (mm) | 1.5 |
| Pin Pitch (mm) | 1.27 |
| Package Weight (g) | 0.22 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | HC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Inputs per Chip | 8 |
| Number of Outputs per Chip | 8 |
| Process Technology | CMOS |
| Polarity | Non-Inverting |
| Output Type | 3-State |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba TC74HC241AF(J) Datasheet
Download the complete datasheet for Toshiba TC74HC241AF(J) to view detailed technical specifications.
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