Quick Jump:
Technical Specifications
Toshiba TC74HC27AFN(ELP,M) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOL
Package Description
Small Outline IC (L Lead)
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Length (mm)
8.65
Package Width (mm)
3.9
Package Height (mm)
1.38
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AB
Logic Family
HC
Logic Function
NOR
Process Technology
CMOS
Number of Elements per Chip
3
Number of Element Inputs
3-IN
Number of Element Outputs
1
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74HC27AFN(ELP,M) Datasheet
Download the complete datasheet for Toshiba TC74HC27AFN(ELP,M) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.