
Positive-edge triggered, D-type bus interface flip-flop with 3-state outputs. This single-element integrated circuit features 8 inputs and 8 non-inverting outputs, utilizing CMOS process technology within the HC logic family. The component is housed in a 20-pin PDIP plastic dual in-line package designed for through-hole mounting, with a pin pitch of 2.54mm. Operating temperature range spans from -40°C to 85°C.
Toshiba TC74HC574AP(TB) technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 25.1(Max) |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.5 |
| Seated Plane Height (mm) | 4.15 |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-001AD |
| Logic Family | HC |
| Logic Function | D-Type Bus Interface |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 8 |
| Number of Element Outputs | 8 |
| Output Type | 3-State |
| Polarity | Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Toshiba TC74HC574AP(TB) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.