PackageSOP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Toshiba TC74HCT245AF(TB,F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOP
Package Description
Plastic Small Outline Package
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
13.3(Max)
Package Width (mm)
5.3
Package Height (mm)
1.5
Pin Pitch (mm)
1.27
Package Weight (g)
0.22
Package Material
Plastic
Mounting
Surface Mount
Logic Family
HCT
Logic Function
Bus Transceiver
Data Flow Direction
Bi-Directional
Number of Elements per Chip
1
Polarity
Non-Inverting
Process Technology
CMOS
Output Type
3-State
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TC74HCT245AF(TB,F) Datasheet
Download the complete datasheet for Toshiba TC74HCT245AF(TB,F) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.